The M02013 Transimpedance Amplifier (TIA) with AGC is manufactured in a sub-micron CMOS process. The AGC allows more than 25 dBm of dynamic range, providing a low-cost solution for 3.2 Gbps receivers.
For optimum system performance, the M02013 die should be mounted with a silicon or InGaAs PIN photodetector inside a lensed TO-Can or other optical sub-assembly. The M02013 reverse biases the PIN by approximately 1.8 volts to optimise performance. A replica of the average photodiode current is available at the MON pad for signal strength monitoring.
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