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M02015

2.5 Gbps AGC Pre-Amplifier

Overview

Description

The M02015 transimpedance amplifier (TIA) with automatic gain control (AGC) is fabricated in sub-micron CMOS for high performance. With typical transimpedance of 9k ohms differential and input-referred noise of 280na, sensitivities of -26 dbm are achievable. With an input overload capability greater than 6ma p-p, the AGC allows more than 32 dB of dynamic range, providing a low-cost solution for longer-reach 2.5 Gbps GPON/ATM/SONET systems, as well as multi-rate 1X/2X Fibre-channel and Gigabit Ethernet transceivers.

Features

Typical -26 dBm sensitivity, > +6 dBm saturation at 2.5 Gbps
Bandwidth 1.8 Ghz (typical)
Input-referred noise of 280na (typical)
Overload of 6ma p-p
Typical differential transimpedance: 9kΩ
Maximum jitter of 70 ps p-p
Differential 100Ω output impedance
Operates on a single 3.3V supply
Monitor Output
AGC provides dynamic range of more than 32 dB

Ordering Information

Part	Description	Package	Pin Count
M02015-11	2.1G, Transimpedance amplifier (TIA), WP	DIE	N/A
M02015-11P	2.1G, Transimpedance amplifier (TIA), WP	DIE	N/A
M02015-21	2.1Gbps TIA - Quartered Wafer	DIE	n/a

Documentation

Sales / Marketing
- White Papers
  - NRZ Bandwidth White Paper (359.19 KB)
    April 3, 2003
- Product Briefs
  - M02015 Product Brief (110.59 KB)
    October 20, 2006
Hardware Design Docs
- PCNs
  - M020xx - Second Backend Processing Site for Die Sales Products PCN (22.74 KB)
    September 8, 2009
  - 020xx - Change to Waffle Pack for Die Sales Product PCN (22.93 KB)
    September 8, 2009
- Data Sheets
  - M02015 Data Sheet (376.5 KB)
    August 16, 2007
- RoHS/IPC Report
  - M02015-11 Wafer Pack Die IPC Report (613.22 KB)
    November 10, 2011
  - M02015-21 QSPBG Wafer IPC Report (602.3 KB)
    November 10, 2011
  - M02015-XX IPC-1752-1 v1.1a TSMC-SSMC (323.53 KB)
    April 29, 2013

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