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M02025

100 Mbps to 3.125 Gbps Multi-rate CMOS TIA with AGC


Overview

Description

The M02025 is a multi-rate 2.5 Gbps TIA with wide input dynamic range that supports different transmission distance
requirements. With a typical input overload of 4 mApp, it supports short-haul fiber optic systems. Additionally, a typical input
sensitivity of -30.0 dBm allows the detection of very small signals in a noisy environment making it ideal for high split ratio PON networks. With ultra-high sensitivity, the M02025 can accurately detect the optical data without requiring the use of APDs
(avalanche photodiodes).

In order to satisfy such high sensitivity and optical overload requirements, the M02025 includes automatic gain control (AGC).
The AGC monitors the output amplitude and automatically reduces the TIA gain when the photodiode current exceeds the AGC threshold, maintaining the output at a constant amplitude level for input signals exceeding the AGC threshold.

An accurate replica across the entire dynamic range of the M02025 of the average photodiode current is available at the MON
pad for photo-alignment and RSSI average power monitoring.

Features

  • Typical -30.0 dBm sensitivity, 120 nARMS noise*
  • Data rates from 100 Mbps 8b/10b to 3.125 Gbps
  • No filter (PINK) capacitor required
  • No internal ROSA VCC filter capacitor required for typical operation
  • Two RSSI (IMON) options to support APD and PIN Diode PD
  • 20 kΩ differential transimpedance
  • 4 mApp overload input current
  • On-die temperature sensor (M02025-14/-24/-34)
  • Bonding flexibility (M02025-15/-25/-35)
  • Internal or external bias for photodiode
  • Single +3.3 V supply
* with 0.35 pF CPD, 135 nARMS with 0.5 pF CPD

Ordering Information

Part Description Package Pin Count Status
M02025-11P 2.5 Gpbs High Sen TIA Waffle Packed Die n/a N/A
M02025-12P 2.5 Gpbs High Sen TIA Waffle Packed Die DIE n/a
M02025-13P 2.5G TIA Waffle Pack DIE n/a
M02025-14 M02025-14-W-PACK-DIE-TESTED DIE SALE N/A
M02025-14P 2.5G TIA Waffle Pack DIE n/a
M02025-16 M02025-16-W-PACK-DIE-TESTED DIE n/a
M02025-16P 2.5G PIN TIA DIE n/a
M02025-24 M02025-24-QSPBG WAFER n/a n/a
M02025-26 M02025-26-QSPBG WAFER DIE n/a
M02025-34 M02025-SAWN-PROBED-DIE-W-BG DIE N/A
M02025-36 M02025-SAWN-PROBED-DIE-W-BG DIE n/a
M02025-REF-001 2.5G PIN ROSA n/a n/a
M02025-REF-002 2.5G APD ROSA n/a n/a
Documentation
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Applications

  • GPON
  • PCI Express
  • InfiniBand
  • 2.5 Gbps SFF/SFP Modules
  • ATM/SONET
  • CPRI base station

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