Transition Timeline
- 2003/2004 - Mindspeed established its conversion strategy early in 2003 and has completed qualifications of several packages in both lead-free and green.
- 2005 - The transition and qualification continues with completion dates of the most complex products by the end of the year with the exception of Flip-chip and CDBGA packages.
- 2006 - Our subcontractors are currently developing RoHS compliant Flip-chip and CDBGA packages that will be completed prior to the July European conversion.
Pb-Free and RoHS (Green) Qualification Timeline
| Package Type | Assembly | Completion Date | Status |
|---|---|---|---|
| PBGA | Amkor Tech. | 12/31/2003 | Qualified |
| MLF/QFN | Amkor Tech. | 2/1/2004 | Qualified |
| FBGA | Amkor Tech. | 2/15/2004 | Qualified |
| SOIC | Amkor Tech. | 3/20/2004 | Qualified |
| ETQFP | Amkor Tech. | 4/22/2004 | Qualified |
| TQFP | ASAT | 7/27/2004 | Qualified |
| PBGA | ASE | 7/29/2004 | Qualified |
| PQFP | Amkor Tech. | 10/15/2004 | Qualified |
| QSOP | Unisem | 10/30/2004 | Qualified |
| HSFBGA | ASE | 11/5/2004 | Qualified |
| BCC | ASE | 03/31/2005 | Qualified |
| TBGA | ASAT | 3/31/2005 | Qualified |
| TSSOP | Unisem | 6/30/2005 | Qualified |
| CDBGA/FCBGA | Contact Mindspeed for details. | ||
Notes:
- All qualified packages are RoHS compliant.
- All Mindspeed wafers and die level products are lead-free.
We will continue to supply the existing standard products until such time that the demand diminishes.
Customers whose product requirements are different than the two versions offered (standard and RoHS compliant products) should contact a Mindspeed Sales representative to review their specific requirements. Product requirements that are different than the versions offered will be considered custom products and may require additional testing.